The Universal-300 X is an advanced 12-inch CMP device developed for the current high-end market. The equipment uses Hwatsing's innovative technology with independent intellectual property rights, is equipped with superior performance polishing and cleaning units, and integrates a variety of advanced endpoint detection technologies. The equipment is efficient and stable, and the process combination is flexible, which can realize the global flattening of the wafer at the nanometer level, meet the needs of advanced manufacturing technology, and is widely used in integrated circuits, advanced packaging, large silicon wafer and other manufacturing processes.
Polishing head with eight independent air pressure zones
Integrate multiple endpoint detection technologies
A and B sides are completely independently designed, serving two processes with one tool and doubling the efficiency
Advanced vertical cleaning technology
Meet the technical requirements of advanced manufacturing process and obtain mass application